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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring

3590 Printed wiring

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76 results
First page12346Last page
CSN EN 61249-4-19
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 01.06.2014
English Hardcopy
In stock
61.00 EUR
CSN EN 61249-2-26
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper clad
Released: 01.08.2005
English Hardcopy
In stock
92.00 EUR
CSN EN 61249-4-12
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide, woven E-glass prepreg of defined flammability
Released: 01.03.2006
English Hardcopy
In stock
69.00 EUR
CSN EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Released: 01.10.2024
English Hardcopy
In stock
69.00 EUR
CSN EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Released: 01.02.2024
English Hardcopy
In stock
52.00 EUR
CSN EN IEC 61189-2-801
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
Released: 01.02.2024
English Hardcopy
In stock
52.00 EUR
CSN EN IEC 61249-2-51
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
Released: 01.11.2023
English Hardcopy
In stock
61.00 EUR
CSN EN 61188-5-4
Printed boards and printed board assemblies - Design and use - Part 5- 4: Attachment (land/joint) considerations - Components with J leads on two sides
Released: 01.04.2008
English Hardcopy
In stock
61.00 EUR
CSN EN 61188-5-8
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Released: 01.09.2008
English Hardcopy
In stock
84.00 EUR
CSN EN 61249-2-35
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008)
Released: 01.09.2009
English Hardcopy
In stock
92.00 EUR
CSN EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Released: 01.10.2021
English Hardcopy
In stock
84.00 EUR
CSN EN IEC 61189-2-630
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
Released: 01.04.2019
English Hardcopy
In stock
52.00 EUR
76 results
First page12346Last page