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Homepage>BS Standards>31 ELECTRONICS>31.240 Mechanical structures for electronic equipment>DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
immediate downloadReleased: 2010-01-31
DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

DD IEC/TS 62610-1:2009

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

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Standard number:DD IEC/TS 62610-1:2009
Pages:28
Released:2010-01-31
ISBN:978 0 580 66986 6
Status:Standard
DESCRIPTION

DD IEC/TS 62610-1:2009


This standard DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series is classified in these ICS categories:
  • 31.240 Mechanical structures for electronic equipment

This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series.

The cooling performance is in direct relation with the mounting location within a cabinet.

Three typical mounting locations are identified:

  • mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;

  • mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;

  • mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.


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