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Homepage>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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95 results
First page1245678Last page
UNE EN 61975:2010/A1:2017
High-voltage direct current (HVDC) installations - System tests (Endorsed by Asociación Española de Normalización in March of 2017.)
Released: 2017-03-01
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71.50 EUR
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71.50 EUR
UNE EN 62415:2010
Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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62.70 EUR
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62.70 EUR
UNE EN 62779-2:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
Released: 2016-07-01
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69.30 EUR
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69.30 EUR
UNE EN 60749-27:2006
Semiconductor devices - Mechanical and climatic test methods -- Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006) (Endorsed by AENOR in November of 2006.)
Released: 2006-11-01
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64.90 EUR
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64.90 EUR
UNE EN 60749-29:2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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74.80 EUR
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74.80 EUR
UNE EN 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
Released: 2017-07-01
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62.70 EUR
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62.70 EUR
UNE EN 60749-37:2008
Semiconductor devices - Mechanical and climatic test methods -- Part 37: Board level drop test method using an accelerometer (Endorsed by AENOR in July of 2008.)
Released: 2008-07-01
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71.50 EUR
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71.50 EUR
UNE EN 60191-6-20:2010
Mechanical standardization of semiconductor devices -- Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (Endorsed by AENOR in February of 2011.)
Released: 2011-02-01
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62.70 EUR
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62.70 EUR
UNE EN 60191-6-3:2000
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Released: 2001-12-01
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69.30 EUR
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69.30 EUR
UNE EN 60191-6-4:2003
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
Released: 2003-10-01
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69.30 EUR
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69.30 EUR
UNE EN IEC 60747-17:2020
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (Endorsed by Asociación Española de Normalización in January of 2021.)
Released: 2021-01-01
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104.50 EUR
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104.50 EUR
UNE 21302-521:2004
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
Released: 2004-05-21
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145.20 EUR
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145.20 EUR
95 results
First page1245678Last page