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Homepage>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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95 results
First page124678Last page
UNE EN 60191-4:2014
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)
Released: 2014-05-01
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75.90 EUR
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75.90 EUR
UNE EN 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (Endorsed by AENOR in September of 2011.)
Released: 2011-09-01
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77.00 EUR
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77.00 EUR
UNE EN 60191-6-21:2010
Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)
Released: 2011-02-01
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66.00 EUR
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UNE EN 60191-6-10:2004
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Released: 2004-05-28
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76.56 EUR
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76.56 EUR
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63.80 EUR
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63.80 EUR
UNE EN 60191-6-2:2003
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Released: 2003-10-10
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75.24 EUR
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75.24 EUR
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62.70 EUR
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62.70 EUR
UNE EN 60191-6-6:2002
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
Released: 2002-03-21
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76.56 EUR
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76.56 EUR
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63.80 EUR
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63.80 EUR
UNE EN 60191-6-8:2002
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
Released: 2002-06-28
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75.24 EUR
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75.24 EUR
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62.70 EUR
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62.70 EUR
UNE EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Released: 2003-11-21
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60.72 EUR
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60.72 EUR
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50.60 EUR
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50.60 EUR
UNE EN IEC 60749-17:2019
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (Endorsed by Asociación Española de Normalización in June of 2019.)
Released: 2019-06-01
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62.70 EUR
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62.70 EUR
UNE EN IEC 60749-26:2018
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (Endorsed by Asociación Española de Normalización in May of 2018.)
Released: 2018-05-01
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99.00 EUR
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99.00 EUR
UNE EN 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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74.80 EUR
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74.80 EUR
UNE EN 60749-39:2006
Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)
Released: 2006-11-01
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50.60 EUR
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50.60 EUR
95 results
First page124678Last page