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Homepage>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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94 results
First page123468Last page
UNE EN 60749-32:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2004-03-18
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46.20 EUR
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46.20 EUR
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38.50 EUR
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38.50 EUR
UNE EN 60749-32:2004/A1:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2011-01-19
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46.20 EUR
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46.20 EUR
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38.50 EUR
Spanish Hardcopy
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38.50 EUR
UNE EN 60749-34:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
Released: 2011-07-20
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77.88 EUR
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77.88 EUR
Spanish PDF
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64.90 EUR
Spanish Hardcopy
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64.90 EUR
UNE EN 60749-36:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Released: 2004-03-18
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46.20 EUR
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46.20 EUR
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38.50 EUR
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38.50 EUR
UNE EN IEC 60749-13:2018
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
Released: 2018-05-01
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69.30 EUR
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69.30 EUR
UNE EN 60191-4:2014/A1:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
Released: 2018-06-01
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69.30 EUR
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69.30 EUR
UNE EN 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
Released: 2017-01-01
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71.50 EUR
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In stock
71.50 EUR
UNE EN 60191-6-18:2010
Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
Released: 2010-05-01
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71.50 EUR
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In stock
71.50 EUR
UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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64.90 EUR
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64.90 EUR
UNE EN 60191-6-22:2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
Released: 2013-04-01
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69.30 EUR
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69.30 EUR
UNE EN 60749-20-1:2009
Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)
Released: 2009-09-01
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108.90 EUR
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108.90 EUR
UNE EN 60749-28:2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in August of 2017.)
Released: 2017-08-01
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88.00 EUR
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88.00 EUR
94 results
First page123468Last page