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Homepage>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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95 results
First page1234568
UNE EN 60749-42:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
Released: 2014-11-01
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46.20 EUR
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46.20 EUR
UNE EN 60749-44:2016
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
Released: 2016-12-01
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72.60 EUR
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72.60 EUR
UNE EN 60191-4:2014/A1:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
Released: 2018-06-01
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69.30 EUR
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69.30 EUR
UNE EN 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
Released: 2017-01-01
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71.50 EUR
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71.50 EUR
UNE EN 60191-6-18:2010
Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
Released: 2010-05-01
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71.50 EUR
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71.50 EUR
UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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64.90 EUR
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64.90 EUR
UNE EN 60191-6-22:2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
Released: 2013-04-01
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69.30 EUR
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69.30 EUR
UNE EN IEC 60749-13:2018
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
Released: 2018-05-01
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69.30 EUR
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69.30 EUR
UNE EN IEC 60749-30:2020
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)
Released: 2020-11-01
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70.40 EUR
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70.40 EUR
UNE EN 61975:2010/A2:2022
High-voltage direct current (HVDC) installations - System tests (Endorsed by Asociación Española de Normalización in January of 2023.)
Released: 2023-01-01
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50.60 EUR
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50.60 EUR
UNE EN IEC 60749-5:2024
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in March of 2024.)
Released: 2024-03-01
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63.80 EUR
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63.80 EUR
95 results
First page1234568