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Homepage>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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178 results
First page123...891011121315
UNE EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures -- Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by AENOR in July of 2005.)
Released: 2005-07-01
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70.40 EUR
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In stock
70.40 EUR
UNE EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)
Released: 2013-05-01
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75.90 EUR
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In stock
75.90 EUR
UNE EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures -- Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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72.60 EUR
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In stock
72.60 EUR
UNE EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures -- Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Released: 2006-01-01
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75.90 EUR
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In stock
75.90 EUR
UNE EN 123000/A2:1996
GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1998.)
Released: 1998-06-01
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78.10 EUR
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In stock
78.10 EUR
UNE EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-05-01
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77.00 EUR
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In stock
77.00 EUR
UNE EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
Released: 2020-01-01
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77.00 EUR
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In stock
77.00 EUR
UNE EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
Released: 2021-05-01
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82.50 EUR
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In stock
82.50 EUR
UNE EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (Endorsed by Asociación Española de Normalización in July of 2024.)
Released: 2024-07-01
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63.80 EUR
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In stock
63.80 EUR
UNE EN IEC 61189-2-720:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (Endorsed by Asociación Española de Normalización in June of 2024.)
Released: 2024-06-01
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66.00 EUR
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In stock
66.00 EUR
178 results
First page123...891011121315