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Homepage>IEC Standards>IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
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download between 0-24 hoursReleased: 2001-10-30
IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

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Standard number:IEC 60191-6-1:2001
Released:2001-10-30
Language:English
DESCRIPTION

IEC 60191-6-1:2001

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

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