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Homepage>IEC Standards>IEC 60191-6-10:2003 - Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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download between 0-24 hoursReleased: 2003-11-19
IEC 60191-6-10:2003 - Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

IEC 60191-6-10:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-10: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON

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Standard number:IEC 60191-6-10:2003
Released:2003-11-19
Language:English/French - Bilingual
DESCRIPTION

IEC 60191-6-10:2003

IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).

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