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Homepage>IEC Standards>IEC 60191-6-19:2010 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
download between 0-24 hoursReleased: 2010-02-25
IEC 60191-6-19:2010 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

IEC 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible

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Standard number:IEC 60191-6-19:2010
Released:2010-02-25
Language:English/French - Bilingual
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IEC 60191-6-19:2010

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

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