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Homepage>IEC Standards>IEC 60191-6-21:2010 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
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download between 0-24 hoursReleased: 2010-08-30
IEC 60191-6-21:2010 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

IEC 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Normalisation mécanique des dispositifs à semiconducters - Partie 6-21: Règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semiconducteurs pour montage en surface - Méthodes de mesure pour les dimensions des boîtiers de faible encombrement (SOP)

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Standard number:IEC 60191-6-21:2010
Released:2010-08-30
Language:English/French - Bilingual
DESCRIPTION

IEC 60191-6-21:2010

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

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