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Homepage>IEC Standards>IEC 60191-6-22:2012 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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download between 0-24 hoursReleased: 2012-12-11
IEC 60191-6-22:2012 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-6-22:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-22: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels à billes et à pas fins en silicium et boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FBGA et S-FLGA)

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Standard number:IEC 60191-6-22:2012
Released:2012-12-11
Language:English/French - Bilingual
DESCRIPTION

IEC 60191-6-22:2012

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).