Homepage>IEC Standards>IEC 60191-6-5:2001 - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
download between 0-24 hoursReleased: 2001-08-27
IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
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Standard number:
IEC 60191-6-5:2001
Released:
2001-08-27
Language:
English
DESCRIPTION
IEC 60191-6-5:2001
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
