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download between 0-24 hoursReleased: 2001-03-22
IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-6: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception des dispositifs FLGA
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English/French - Bilingual PDF
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88.00 EUR
English/French - Bilingual Hardcopy
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| Standard number: | IEC 60191-6-6:2001 |
| Released: | 2001-03-22 |
| Language: | English/French - Bilingual |
DESCRIPTION
IEC 60191-6-6:2001
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.