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Homepage>IEC Standards>IEC 60191-6-8:2001 - Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
download between 0-24 hoursReleased: 2001-08-27
IEC 60191-6-8:2001 - Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quadrangulaires en céramique, scellement verre (G-QFP)

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Standard number:IEC 60191-6-8:2001
Released:2001-08-27
Language:English
DESCRIPTION

IEC 60191-6-8:2001

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

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