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download between 0-24 hoursReleased: 2003-08-07
IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 14: Robustesse des sorties (integrité des connexions)
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English/French - Bilingual PDF
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88.00 EUR
English/French - Bilingual Hardcopy
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88.00 EUR
| Standard number: | IEC 60749-14:2003 |
| Released: | 2003-08-07 |
| Language: | English/French - Bilingual |
DESCRIPTION
IEC 60749-14:2003
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
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