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Homepage>IEC Standards>IEC 60749-16:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
download between 0-24 hoursReleased: 2003-01-17
IEC 60749-16:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 16: Détection de bruit d'impact de particules (PIND)

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Standard number:IEC 60749-16:2003
Released:2003-01-17
Language:English/French - Bilingual
DESCRIPTION

IEC 60749-16:2003

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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