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Homepage>IEC Standards>IEC 60749-22:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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download between 0-24 hoursReleased: 2002-09-12
IEC 60749-22:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés

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Standard number:IEC 60749-22:2002
Released:2002-09-12
Language:English/French - Bilingual
DESCRIPTION

IEC 60749-22:2002

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

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