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Homepage>IEC Standards>IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
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download between 0-24 hoursReleased: 2002-08-30
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

IEC 60749-31:2002

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 31: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause interne d'inflammation)

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Standard number:IEC 60749-31:2002
Released:2002-08-30
Language:English/French - Bilingual
DESCRIPTION

IEC 60749-31:2002

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.