IEC 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Dispositifs à semiconducteurs - Méthodes d'essais climatiques et mécaniques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte
| Standard number: | IEC 60749-40:2011 |
| Released: | 2011-07-13 |
| Language: | English/French - Bilingual |
IEC 60749-40:2011
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.