IEC 60749-5:2023
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation
| Standard number: | IEC 60749-5:2023 |
| Released: | 2023-12-19 |
| Language: | English/French - Bilingual |
IEC 60749-5:2023
IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.