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Homepage>IEC Standards>IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
download between 0-24 hoursReleased: 2002-08-30
IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC 60749-8:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8: Etanchéité

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Standard number:IEC 60749-8:2002
Released:2002-08-30
Language:English/French - Bilingual
DESCRIPTION

IEC 60749-8:2002

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

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