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Homepage>IEC Standards>IEC 61188-5-2:2003 - Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
download between 0-24 hoursReleased: 2003-06-24
IEC 61188-5-2:2003 - Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

IEC 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-2: Considérations sur les liaisons pistes-soudures - Composants discrets

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Standard number:IEC 61188-5-2:2003
Released:2003-06-24
Language:English/French - Bilingual
DESCRIPTION

IEC 61188-5-2:2003

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

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