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Homepage>IEC Standards>IEC 61188-5-6:2003 - Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

IEC 61188-5-6:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-6: Considérations sur les liaisons pistes-soudures - Composants à sorties en J sur quatre côtés

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Standard number:	IEC 61188-5-6:2003
Released:	2003-01-23
Language:	English/French - Bilingual

DESCRIPTION

IEC 61188-5-6:2003

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

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