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Homepage>IEC Standards>IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
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download between 0-24 hoursReleased: 2021-02-23
IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-1: Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes imprimées

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Standard number:IEC 61188-6-1:2021
Released:2021-02-23
Language:English/French - Bilingual
DESCRIPTION

IEC 61188-6-1:2021

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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