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Homepage>IEC Standards>IEC 61188-6-2:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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download between 0-24 hoursReleased: 2021-02-04
IEC 61188-6-2:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants

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Standard number:IEC 61188-6-2:2021
Released:2021-02-04
Language:English/French - Bilingual
DESCRIPTION

IEC 61188-6-2:2021

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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