Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>IEC Standards>IEC 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Sponsored link
download between 0-24 hoursReleased: 2013-05-07
IEC 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 11: Mesure de la température de fusion ou des plages de températures de fusion des alliages à braser

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
88.00 EUR
English/French - Bilingual Hardcopy
in stock
88.00 EUR
Standard number:IEC 61189-11:2013
Released:2013-05-07
Language:English/French - Bilingual
DESCRIPTION

IEC 61189-11:2013

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Print