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Homepage>IEC Standards>IEC 61190-1-1:2002 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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download between 0-24 hoursReleased: 2002-03-25
IEC 61190-1-1:2002 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

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Standard number:IEC 61190-1-1:2002
Released:2002-03-25
Language:English/French - Bilingual
DESCRIPTION

IEC 61190-1-1:2002

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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