IEC 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques
| Standard number: | IEC 61190-1-2:2014 |
| Released: | 2014-02-19 |
| Language: | English/French - Bilingual |
IEC 61190-1-2:2014
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of "Reflow condition and profile" in Annex B; c) addition of a new Annex C.