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download between 0-24 hoursReleased: 2011-07-26
IEC 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS
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| Standard number: | IEC 62047-10:2011 |
| Released: | 2011-07-26 |
| Language: | English/French - Bilingual |
DESCRIPTION
IEC 62047-10:2011
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.