PRICES include / exclude VAT
Homepage>IEC Standards>IEC 62047-2:2006 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Sponsored link
download between 0-24 hoursReleased: 2006-08-15
IEC 62047-2:2006 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

IEC 62047-2:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 2: Méthode d'essai de traction des matériaux en couche mince

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
88.00 EUR
English/French - Bilingual Hardcopy
in stock
88.00 EUR
Standard number:IEC 62047-2:2006
Released:2006-08-15
Language:English/French - Bilingual
DESCRIPTION

IEC 62047-2:2006

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.