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Homepage>IEC Standards>IEC 62137-1-1:2007 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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download between 0-24 hoursReleased: 2007-07-11
IEC 62137-1-1:2007 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-1: Essai de résistance à la traction

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Standard number:IEC 62137-1-1:2007
Released:2007-07-11
Language:English/French - Bilingual
DESCRIPTION

IEC 62137-1-1:2007

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

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