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Homepage>IEC Standards>IEC 62418:2010 - Semiconductor devices - Metallization stress void test
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download between 0-24 hoursReleased: 2010-04-22
IEC 62418:2010 - Semiconductor devices - Metallization stress void test

IEC 62418:2010

Semiconductor devices - Metallization stress void test

Dispositifs à semiconducteurs - Essai sur les cavités dues aux contraintes de la métallisation

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Standard number:IEC 62418:2010
Released:2010-04-22
Language:English/French - Bilingual
DESCRIPTION

IEC 62418:2010

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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