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download between 0-24 hoursReleased: 2023-04-05
IEC 62769-4:2023
Field Device Integration (FDI®) - Part 4: FDI Packages
Intégration des appareils de terrain (FDI®) - Partie 4: Paquetages FDI
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| Standard number: | IEC 62769-4:2023 |
| Released: | 2023-04-05 |
| Language: | English/French - Bilingual |
DESCRIPTION
IEC 62769-4:2023
IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.