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Homepage>IEC Standards>IEC 62899-202-10:2023 - Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
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download between 0-24 hoursReleased: 2023-08-16
IEC 62899-202-10:2023 - Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

IEC 62899-202-10:2023

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

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Standard number:IEC 62899-202-10:2023
Released:2023-08-16
Language:English
DESCRIPTION

IEC 62899-202-10:2023

IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation. This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

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