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Homepage>IEC Standards>IEC 63378-2-1:2024 - Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
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download between 0-24 hoursReleased: 2024-10-22
IEC 63378-2-1:2024 - Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

IEC 63378-2-1:2024

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

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Standard number:IEC 63378-2-1:2024
Released:2024-10-22
Language:English
DESCRIPTION

IEC 63378-2-1:2024

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

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