Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>IEC Standards>IEC TR 60286-7:2019 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
Sponsored link
download between 0-24 hoursReleased: 2019-10-14
IEC TR 60286-7:2019 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Emballage de composants pour opérations automatisées - Partie 7: Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
88.00 EUR
English/French - Bilingual Hardcopy
in stock
88.00 EUR
Standard number:IEC TR 60286-7:2019
Released:2019-10-14
Language:English/French - Bilingual
DESCRIPTION

IEC TR 60286-7:2019

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Print