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Homepage>IEC Standards>IEC TR 61191-7:2020 - Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
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download between 0-24 hoursReleased: 2020-03-11
IEC TR 61191-7:2020 - Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC TR 61191-7:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

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Standard number:IEC TR 61191-7:2020
Released:2020-03-11
Language:English
DESCRIPTION

IEC TR 61191-7:2020

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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