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Homepage>IEC Standards>IEC TS 62454:2007 - Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
download between 0-24 hoursReleased: 2007-10-10
IEC TS 62454:2007 - Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

IEC TS 62454:2007

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

Structures mécaniques pour équipement électronique - Guide de conception: Dimensions d'interface et dispositions relatives au refroidissement par l'eau des équipements électroniques dans les armoires des séries CEI 60297 et CEI 60917

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Standard number:IEC TS 62454:2007
Released:2007-10-10
Language:English/French - Bilingual
DESCRIPTION

IEC TS 62454:2007

Provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. Is applicable to cabinets in accordance with the IEC 60297 (19 in) and IEC 60917 (25 mm) series.

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