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Homepage>IEC Standards>IEC TS 62610-1:2009 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
download between 0-24 hoursReleased: 2009-09-16
IEC TS 62610-1:2009 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

IEC TS 62610-1:2009

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

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Standard number:IEC TS 62610-1:2009
Released:2009-09-16
Language:English
DESCRIPTION

IEC TS 62610-1:2009

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified: 1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; 2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet; 3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

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