PD IEC TR 60286-7:2019 - Packaging of Components for Automatic Handling

Standard Number: PD IEC TR 60286-7:2019

Pages: 16

Released: October 29, 2019

ISBN: 978 0 539 03266 6

Status: Standard

Introduction

In the ever-evolving world of electronics and miniaturization, the need for efficient and reliable packaging solutions is paramount. The PD IEC TR 60286-7:2019 standard addresses this need by introducing a bulk blister pack specifically designed for miniaturized components. This standard is a crucial resource for manufacturers and suppliers who are looking to optimize their packaging processes for automatic handling systems.

Why Choose Bulk Blister Packs?

Bulk blister packs offer a range of benefits that make them an ideal choice for packaging miniaturized components:

• Protection: The blister pack design provides excellent protection against physical damage, moisture, and contamination, ensuring that components remain in pristine condition until they are ready for use.
• Efficiency: Designed for automatic handling, these packs streamline the manufacturing process, reducing manual handling and increasing throughput.
• Cost-Effective: By minimizing damage and loss, bulk blister packs can lead to significant cost savings over time.
• Space-Saving: The compact design of blister packs allows for efficient use of storage and transportation space.

Key Features of PD IEC TR 60286-7:2019

This standard provides comprehensive guidelines for the packaging of miniaturized components, ensuring compatibility with automatic handling systems. Key features include:

• Standardized Dimensions: Ensures uniformity across different manufacturers, facilitating seamless integration into existing systems.
• Material Specifications: Details the materials suitable for blister packs, focusing on durability and environmental impact.
• Handling Guidelines: Offers best practices for handling and storage to maintain the integrity of the components.
• Testing Procedures: Outlines methods for testing the packaging to ensure it meets the required standards for protection and durability.

Applications

The PD IEC TR 60286-7:2019 standard is applicable across a wide range of industries where miniaturized components are used. These include:

• Consumer Electronics: Smartphones, tablets, and other personal devices.
• Automotive: Advanced driver-assistance systems (ADAS) and infotainment systems.
• Medical Devices: Wearable health monitors and diagnostic equipment.
• Telecommunications: Networking equipment and communication devices.

Benefits of Compliance

Adhering to the PD IEC TR 60286-7:2019 standard offers numerous benefits, including:

• Quality Assurance: Ensures that components are packaged to the highest standards, reducing the risk of defects and failures.
• Regulatory Compliance: Helps manufacturers meet industry regulations and standards, avoiding potential legal issues.
• Market Competitiveness: By adopting the latest packaging technologies, companies can stay ahead of the competition.
• Customer Satisfaction: Reliable packaging leads to fewer returns and complaints, enhancing customer trust and loyalty.

Conclusion

The PD IEC TR 60286-7:2019 standard is an essential tool for any organization involved in the production or supply of miniaturized components. By providing a detailed framework for the packaging of these components, it ensures that they are protected, efficiently handled, and ready for use in a variety of applications. Embracing this standard not only enhances operational efficiency but also contributes to the overall quality and reliability of the end products.

For manufacturers and suppliers looking to optimize their packaging processes, the PD IEC TR 60286-7:2019 standard is an invaluable resource that offers both practical guidance and strategic advantages in the competitive electronics market.

PD IEC TR 60286-7:2019

This standard PD IEC TR 60286-7:2019 Packaging of components for automatic handling is classified in these ICS categories:

• 31.020 Electronic components in general
• 31.240 Mechanical structures for electronic equipment

This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.