PD IEC TR 61191-8:2021 - Best Practices for Automotive Electronic Control Units

In the rapidly evolving world of automotive electronics, ensuring the reliability and performance of electronic control units (ECUs) is paramount. The PD IEC TR 61191-8:2021 standard provides comprehensive guidelines and best practices for managing voiding in solder joints of printed board assemblies, specifically tailored for use in automotive ECUs.

Overview of the Standard

This standard, released on March 25, 2021, is a crucial document for professionals in the automotive electronics industry. It addresses the critical issue of voiding in solder joints, which can significantly impact the performance and longevity of electronic assemblies. With a total of 38 pages, this standard offers in-depth insights and practical solutions to mitigate voiding, ensuring optimal functionality of automotive ECUs.

Key Features

• Standard Number: PD IEC TR 61191-8:2021
• Pages: 38
• Release Date: March 25, 2021
• ISBN: 978 0 539 15088 9
• Status: Standard

Importance of Managing Voiding in Solder Joints

Voiding in solder joints is a common issue that can lead to a range of problems, including reduced thermal and electrical conductivity, mechanical instability, and ultimately, failure of the electronic assembly. In the context of automotive ECUs, where reliability is non-negotiable, managing voiding is essential to ensure the safety and efficiency of vehicles.

Benefits of Implementing the Standard

By adhering to the guidelines set forth in the PD IEC TR 61191-8:2021 standard, manufacturers and engineers can achieve several benefits:

• Enhanced Reliability: Reduce the risk of solder joint failure, ensuring the long-term reliability of automotive ECUs.
• Improved Performance: Maintain optimal electrical and thermal conductivity, crucial for the performance of electronic assemblies.
• Cost Efficiency: Minimize the need for rework and repairs, leading to cost savings in production and maintenance.
• Compliance: Meet industry standards and regulations, enhancing the credibility and marketability of automotive products.

Who Should Use This Standard?

The PD IEC TR 61191-8:2021 standard is an invaluable resource for a wide range of professionals in the automotive electronics sector, including:

• Design Engineers: Gain insights into best practices for designing printed board assemblies with minimal voiding.
• Manufacturing Engineers: Implement effective processes to control voiding during production.
• Quality Assurance Teams: Develop robust testing and inspection protocols to ensure compliance with the standard.
• R&D Professionals: Stay informed about the latest advancements and methodologies in solder joint technology.

Comprehensive Coverage

The PD IEC TR 61191-8:2021 standard covers a wide range of topics related to voiding in solder joints, including:

• Causes of Voiding: Understand the various factors that contribute to void formation in solder joints.
• Detection and Measurement: Learn about the latest techniques and tools for detecting and measuring voids.
• Prevention Strategies: Discover effective strategies to prevent voiding during the design and manufacturing stages.
• Case Studies: Explore real-world examples and case studies that illustrate successful implementation of best practices.

Conclusion

In the competitive and safety-critical field of automotive electronics, adhering to the PD IEC TR 61191-8:2021 standard is essential for ensuring the reliability and performance of electronic control units. By implementing the best practices outlined in this standard, manufacturers and engineers can significantly reduce the risk of voiding in solder joints, leading to more reliable and efficient automotive systems.

Whether you are involved in design, manufacturing, quality assurance, or research and development, the PD IEC TR 61191-8:2021 standard is an indispensable tool for achieving excellence in automotive electronic assemblies. Embrace the guidelines and insights provided in this comprehensive document to enhance the quality and reliability of your products, and stay ahead in the ever-evolving automotive industry.

PD IEC TR 61191-8:2021

• 31.180 Printed circuits and boards
• 31.190 Electronic component assemblies

This part of IEC 61191 gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X-ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given.

Annex A collects typical voiding levels of components and recommendations for acceptability.