PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
| Standard number: | PD IEC TR 61760-3-1:2022 |
| Pages: | 30 |
| Released: | 2022-10-31 |
| ISBN: | 978 0 539 17936 1 |
| Status: | Standard |
PD IEC TR 61760-3-1:2022 Surface Mounting Technology Standard
Standard Number: PD IEC TR 61760-3-1:2022
Pages: 30
Released: 2022-10-31
ISBN: 978 0 539 17936 1
Status: Standard
Overview
The PD IEC TR 61760-3-1:2022 is a comprehensive standard that provides a detailed methodology for the specification of components used in through hole reflow (THR) soldering. This standard is essential for professionals in the electronics manufacturing industry who are looking to ensure the highest quality and reliability in their surface mounting technology processes.
Key Features
- Standard Number: PD IEC TR 61760-3-1:2022
- Pages: 30
- Released: 2022-10-31
- ISBN: 978 0 539 17936 1
- Status: Standard
Detailed Description
This standard is a crucial document for anyone involved in the design and manufacturing of electronic components. It provides guidelines for the design of through hole diameters using the solder paste surface printing method, ensuring that components are correctly specified for THR soldering. The document is meticulously structured to offer clear and concise instructions, making it an invaluable resource for engineers and technicians.
Why This Standard is Important
In the fast-evolving world of electronics manufacturing, maintaining high standards is critical. The PD IEC TR 61760-3-1:2022 standard helps manufacturers achieve this by providing a reliable method for specifying components. This ensures that the components meet the necessary quality and performance criteria, reducing the risk of defects and improving overall product reliability.
Comprehensive Guidelines
The standard includes detailed guidelines for the design of through hole diameters, which is a critical aspect of the THR soldering process. By following these guidelines, manufacturers can ensure that their components are compatible with the solder paste surface printing method, leading to more efficient and effective production processes.
Who Should Use This Standard?
This standard is designed for a wide range of professionals in the electronics manufacturing industry, including:
- Design Engineers
- Manufacturing Engineers
- Quality Assurance Professionals
- Production Managers
- Technicians
Benefits of Using This Standard
By adhering to the PD IEC TR 61760-3-1:2022 standard, manufacturers can enjoy several benefits, including:
- Improved Quality: Ensures that components meet high-quality standards, reducing the risk of defects.
- Enhanced Reliability: Provides a reliable method for specifying components, leading to more consistent and reliable products.
- Increased Efficiency: Streamlines the design and manufacturing process, saving time and resources.
- Compliance: Helps manufacturers comply with industry standards and regulations.
Conclusion
The PD IEC TR 61760-3-1:2022 standard is an essential resource for anyone involved in the design and manufacturing of electronic components. By providing clear and comprehensive guidelines for the specification of components for THR soldering, this standard helps manufacturers achieve the highest levels of quality and reliability. Whether you are a design engineer, manufacturing engineer, or quality assurance professional, this standard is a valuable tool that can help you improve your processes and products.
PD IEC TR 61760-3-1:2022
This standard PD IEC TR 61760-3-1:2022 Surface mounting technology is classified in these ICS categories:
- 31.190 Electronic component assemblies