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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
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immediate downloadReleased: 2014-05-07
PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

PD IEC/TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

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Standard number:PD IEC/TR 62866:2014
Pages:96
Released:2014-05-07
ISBN:978 0 580 83339 7
Status:Standard
DESCRIPTION

PD IEC/TR 62866:2014


This standard PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.


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