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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>PD IEC/TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
immediate downloadReleased: 2016-08-31
PD IEC/TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

PD IEC/TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

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Standard number:PD IEC/TS 61189-3-301:2016
Pages:20
Released:2016-08-31
ISBN:978 0 580 93803 0
Status:Standard
DESCRIPTION

PD IEC/TS 61189-3-301:2016


This standard PD IEC/TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.


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