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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
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immediate downloadReleased: 2015-04-30
PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology

PD IEC/TS 62878-2-1:2015

Device embedded substrate Guidelines. General description of technology

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Standard number:PD IEC/TS 62878-2-1:2015
Pages:34
Released:2015-04-30
ISBN:978 0 580 82120 2
Status:Standard
DESCRIPTION

PD IEC/TS 62878-2-1:2015


This standard PD IEC/TS 62878-2-1:2015 Device embedded substrate is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 31.180 Printed circuits and boards

This part of IEC 62878 describes the basics of device embedding substrate.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.