PD ISO/TR 16268:2009
Surface chemical analysis. Proposed procedure for certifying the retained areic dose in a working reference material produced by ion implantation
Standard number: | PD ISO/TR 16268:2009 |
Pages: | 30 |
Released: | 2009-11-30 |
ISBN: | 978 0 580 55764 4 |
Status: | Standard |
PD ISO/TR 16268:2009
This standard PD ISO/TR 16268:2009 Surface chemical analysis. Proposed procedure for certifying the retained areic dose in a working reference material produced by ion implantation is classified in these ICS categories:
- 71.040.30 Chemical reagents
- 71.040.40 Chemical analysis
This Technical Report specifies a procedure for the certification of the areic dose of an ion-implanted analyte element of atomic number larger than that of silicon retained in a working reference material (WoRM) intended for surface-analytical use. The WoRM is in the form of a polished (or similarly smooth-faced) wafer (also referred to as the host), of uniform composition and nominal diameter 50 mm or more, that has been ion-implanted with nominally one isotope of a chemical element (also referred to as the analyte), not already present in the host, to a nominal areic dose normally within the range 1016 atoms/cm2 to 1013 atoms/cm2 (i.e. the range of primary interest in semiconductor technology). The areic dose of the ion-implanted analyte retained in the WoRM wafer is certified against the areic dose of the same analyte retained in an ion-implanted silicon wafer having the status of a (preferably certified) secondary reference material (SeRM).
Information is provided on the concept and the procedure for certification of the WoRM. There is also a description of the requirements for the reference materials, the comparative measurements and the actual certification. Supporting information on ion implantation, ion-implantation dosimetry, wavelength-dispersive X-ray fluorescence spectroscopy and non-certified substitutes for unobtainable SeRMs is provided in Annexes A to D. Sources and magnitudes of uncertainties arising in the certification process are detailed in Annex E.