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Homepage>UNE standards>UNE EN 60191-6-2:2003 Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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in stockReleased: 2003-10-10
UNE EN 60191-6-2:2003 Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

UNE EN 60191-6-2:2003

Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Normalización mecánica de dispositivos semiconductores. Parte 6-2: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Guía de diseño para paquetes de terminales de columnas y bolas de paso 1,50 mm, 1.27 mm y 1,00 mm

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Standard number:UNE EN 60191-6-2:2003
Pages:22
Released:2003-10-10
Status:Standard
DESCRIPTION

This standard UNE EN 60191-6-2:2003 Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages is classified in these ICS categories:

  • 31.080.01