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Homepage>UNE standards>UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
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in stockReleased: 2011-01-19
UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE EN 60749-19:2003/A1:2011

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 19: Resistencia de la pastilla al cizallamiento.

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Standard number:UNE EN 60749-19:2003/A1:2011
Pages:12
Released:2011-01-19
Status:Amendment
DESCRIPTION

This standard UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength is classified in these ICS categories:

  • 31.080.01
Categories:
UNE standards
31.080.01 Semiconductor devices in general
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