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Homepage>UNE standards>UNE EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
in stockReleased: 2003-11-21
UNE EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE EN 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 19: Resistencia de la pastilla al cizallamiento.

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Standard number:UNE EN 60749-19:2003
Pages:18
Released:2003-11-21
Status:Standard
DESCRIPTION

This standard UNE EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength is classified in these ICS categories:

  • 31.080.01